List of I.P for sale
Intellectual property
| Domestic or overseas | Domestic | Form of the I.P | Patent |
|---|---|---|---|
| Patent no. | US 15/109,854 | Registration no. | 9,685,397 |
| Name of the invention | SEMICONDUCTOR PACKAGE WITH CLIP STRUCTURE | ||
| Name of the invention(English) | SEMICONDUCTOR PACKAGE WITH CLIP STRUCTURE | ||
| I.P sector | Electronics | ||
| Image file[C] | |||
| Attached file | |||
| Patent evaluation rating | Patent evaluation score | ||
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Commercialization information
| I.P Abstract & Summary | A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead frame; and an adhesion layer disposed between the lead and the second end of the downset to allow adhesion therebeween; wherein the downset is bent in a non-right angle at the first end thereof such that a bottom face of the second end of the downset is tilted toward a top face of the lead and thus a first side of both sides of the bottom face is closer to the top face of the lead than a second side opposite the first side, wherein a first trap region is defined between a side face of the second end at the first side and the top face of the lead to trap therein an adhesion material of the adhesion layer, wherein a second trap region is defined between the bottom face of the second end and the top face of the lead to trap therein an adhesion material of the adhesion layer. |
|---|---|
| Trade type of the I.P | Rights transfer ( Consultation ) |
| Decide after agreement | |
| I.P stage | R&D stage |
#SEMICONDUCTOR, #STRUCTURE
