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Intellectual property

Intellectual property
Domestic or overseas Domestic Form of the I.P Patent
Patent no. US  17/771,550 Registration no. 12,139,785
Name of the invention METHOD FOR FORMING COATING LAYER HAVING PLASMA RESISTANCE
Name of the invention(English) METHOD FOR FORMING COATING LAYER HAVING PLASMA RESISTANCE
I.P sector Chemical
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Commercialization information

Commercialization information
I.P Abstract & Summary The present invention relates to a method of forming a coating layer having plasma resistance, the method comprising steps of: preparing a substrate by placing the substrate in a substrate fixing device inside a process chamber; evaporating a Y.sub.2O.sub.3 deposition material provided in a solid form in an electron beam source by irradiating an electron beam on the Y.sub.2O.sub.3 deposition material; generating radical particles having activation energy by injecting a process gas containing oxygen for forming radicals into a RF energy beam source; irradiating an RF energy beam including the radical particles generated in the RF energy beam source, toward the substrate; depositing a thin film in which the evaporated deposition material is deposited on the substrate by being assisted by the RF energy beam, and densifying the thin film in which the deposition material deposited on the substrate forms a densified film by ion bombardment of the RF energy beam.
Trade type of the I.P Rights transfer ( Consultation )
Decide after agreement
I.P stage R&D completed

#FORMING COATING LAYER, #PLASMA RESISTANCE