List of I.P for sale
Intellectual property
| Domestic or overseas | Domestic | Form of the I.P | Patent |
|---|---|---|---|
| Patent no. | US 17/173,390 | Registration no. | |
| Name of the invention | In-mold Electronic Structure Using Plating Process and Method Therefor | ||
| Name of the invention(English) | In-mold Electronic Structure Using Plating Process and Method Therefor | ||
| I.P sector | Electronics | ||
| Image file[C] | |||
| Attached file | |||
| Patent evaluation rating | Patent evaluation score | ||
| Technology valuation | |||
Commercialization information
| I.P Abstract & Summary | An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated. |
|---|---|
| Trade type of the I.P | Rights transfer ( Consultation ) |
| Decide after agreement | |
| I.P stage | Idea stage |
#In-mold Electronic Structure, #Plating Process, #Method Therefor
