List of I.P for sale
Intellectual property
| Domestic or overseas | Domestic | Form of the I.P | Patent |
|---|---|---|---|
| Patent no. | US 16/226,937 | Registration no. | 11,056,420 |
| Name of the invention | PRESSING-TYPE SEMICONDUCTOR POWER DEVICE PACKAGE | ||
| Name of the invention(English) | PRESSING-TYPE SEMICONDUCTOR POWER DEVICE PACKAGE | ||
| I.P sector | Electronics | ||
| Image file[C] | |||
| Attached file | |||
| Patent evaluation rating | Patent evaluation score | ||
| Technology valuation | |||
Commercialization information
| I.P Abstract & Summary | The present invention relates generally to a pressing-type semiconductor power device package, and more specifically to a pressing-type semiconductor power device package in which a semiconductor chip, such as a transistor or diode, is formed into a package via a pressing structure without using any conductive adhesive, such as solder, which is used in the past, thereby improving production efficiency and durability. |
|---|---|
| Trade type of the I.P | Rights transfer ( Consultation ) |
| Decide after agreement | |
| I.P stage | Idea stage |
#PRESSING-TYPE, #SEMICONDUCTOR, #POWER, #DEVICE, #PACKAGE
