List of I.P for sale
Intellectual property
| Domestic or overseas | Domestic | Form of the I.P | Patent |
|---|---|---|---|
| Patent no. | US 15/947,877 | Registration no. | 10,204,848 |
| Name of the invention | SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE | ||
| Name of the invention(English) | SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE | ||
| I.P sector | Electronics | ||
| Image file[C] | |||
| Attached file | |||
| Patent evaluation rating | Patent evaluation score | ||
| Technology valuation | |||
Commercialization information
| I.P Abstract & Summary | Disclosed herein is a semiconductor chip package having a heat dissipating structure. The semiconductor chip package including: a semiconductor chip configured such that a plurality of terminals protrudes from the upper surface thereof; lead frames connected to the terminals located on the upper surface of the semiconductor chip; and a package body configured to protect the semiconductor chip and the lead frames and to form the outside shape of the semiconductor chip package, and formed by molding. The lower surfaces of the lead frames are exposed to the outside. The lower surface of the package body is partially cut out such that the bottom surface of the semiconductor chip is exposed to the outside. |
|---|---|
| Trade type of the I.P | Rights transfer ( Consultation ) |
| Decide after agreement | |
| I.P stage | R&D stage |
#SEMICONDUCTOR CHIP, #HEAT, #DISSIPATING, #STRUCTURE
