List of I.P for sale
Intellectual property
| Domestic or overseas | Domestic | Form of the I.P | Patent |
|---|---|---|---|
| Patent no. | US 15/407,198 | Registration no. | |
| Name of the invention | CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE | ||
| Name of the invention(English) | CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE | ||
| I.P sector | Electronics | ||
| Image file[C] | |||
| Attached file | |||
| Patent evaluation rating | Patent evaluation score | ||
| Technology valuation | |||
Commercialization information
| I.P Abstract & Summary | A clip-bonded semiconductor chip package comprises a lead frame having a pad and a lead; a semiconductor chip bonded onto the pad of the lead frame; a bonding pad on the semiconductor chip; metal bumps formed on the bonding pad; a clip having first and second portions coupled to each other wherein the first portion is bonded to the bonding pad via the metal bumps, wherein the second portion is bonded to the lead of the lead frame; and a package body made of a molding material around the lead frame, the semiconductor chip and the clip. |
|---|---|
| Trade type of the I.P | Rights transfer ( Consultation ) |
| Decide after agreement | |
| I.P stage | Idea stage |
#CLIP-BONDED SEMICONDUCTOR CHIP, #PACKAGE, #METAL BUMPS, #MANUFACTURING
