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List of I.P for sale

List of I.P for sale

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[Patent]Fermented mineral raw-edible pill with constipation reduction and fatigue recovery and method for pr

The invention relates to a method for producing a fermented mineral pill with constipation reduct...

  • Registered : 2026.06.09
  • View : 31

Trade available

[Patent]Automatic cooking device standardization system

An automatic cooking device standardization system is provided. The automatic cooking device stan...

  • Registered : 2026.06.09
  • View : 35

Trade available

[Patent]EMERGENCY REPORTING DEVICE AND METHOD

An emergency reporting device comprises a location detecting unit configured to detect a current...

  • Registered : 2026.06.09
  • View : 59

Trade available

[Patent]ORNAMENT STUD STRUCTURE

An ornament stud for an article is provided. The stud includes: a head having a three-dimensional...

  • Registered : 2026.06.08
  • View : 58

Trade available

[Patent]FOLDABLE HANGER

There is provided a foldable hanger; a body; a vertical elongate member vertically moveably recei...

  • Registered : 2026.06.08
  • View : 83

Trade available

[Patent]Liquid container with spout with being easily opened

In a liquid container with easy opening of a spout thereof in accordance with the present disclos...

  • Registered : 2026.06.08
  • View : 655

Trade available

[Patent]WINDOW HAVING A RAINWATER GUIDE DEVICE ATTACHED THERETO

A rainwater guide device is coupled to an outer side of the rail portion to be adjacent to the ra...

  • Registered : 2026.06.08
  • View : 65

Trade available

[Patent]Protection assembly for ear-mounted sound-output device

A protection assembly for an ear-mounted sound-output device, the assembly comprising: one pair o...

  • Registered : 2026.06.08
  • View : 79

Trade available

[Patent]WEARABLE POINTING DEVICE

There is provided a wearable pointing device comprising: a body; and a finger-mounted portion cou...

  • Registered : 2026.06.08
  • View : 72

Trade available

[Patent]SEMICONDUCTOR PACKAGE WITH CLIP STRUCTURE

A semiconductor package comprise a downset has a first end coupled to a connection portion and a...

  • Registered : 2026.06.08
  • View : 60

Trade available

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