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List of I.P for sale

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[Patent]METHOD FOR FORMING THREE-DIMENSIONAL DECORATION ON WALL SURFACE, AND THREE-DIMENSIONAL DECORATION FO

There is provided a method for forming a three-dimensional decoration on a wall surface, wherein...

  • Registered : 2026.06.09
  • View : 19

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[Patent]THERMALLY-CONDUCTIVE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME

In a first aspect of the present disclosure, there is provided a thermally-conductive composition...

  • Registered : 2026.06.09
  • View : 20

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[Patent]PREFABRICATED SPIRAL STAIRCASE

The present invention relates to a prefabricated spiral staircase in which the heights between tr...

  • Registered : 2026.06.09
  • View : 14

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[Patent]USER DEVICE AND COMPUTER PROGRAM FOR TRANSLATING RECOGNIZED SPEECH

There is provided a computer-readable storage medium having stored thereon a computer program com...

  • Registered : 2026.06.09
  • View : 16

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[Patent]LED-BASED ILLUMINATION ASSEMBLY WITH ADJUSTABLE IRRADIATION ANGLE

This application claims the benefit of Korean patent application No. 10-2016-0084623 filed on Jul...

  • Registered : 2026.06.09
  • View : 16

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[Patent]MUSICAL INSTRUMENT SUPPORT DEVICE

There is provided a musical instrument support device comprising: first and second elongate pads...

  • Registered : 2026.06.09
  • View : 17

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[Patent]REAL WOOD FILM AND METHOD OF MANUFACTURING INJECTION-MOLDED REAL WOOD PRODUCT BY USING THE SAME

Disclosed herein are a real wood film and a method of manufacturing an injection-molded real wood...

  • Registered : 2026.06.09
  • View : 17

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[Patent]SPRING BED DEVICE WITH HEATING FUNCTION

There is provided a bed device comprising: a support plate; a spring mattress provided on the sup...

  • Registered : 2026.06.09
  • View : 15

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[Patent]RENEWABLE POWER GENERATION FARM FOR FISHING WORK

The present invention relates to a renewable power generation farm for fishing work. More particu...

  • Registered : 2026.06.09
  • View : 16

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[Patent]SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE

Disclosed herein is a semiconductor chip package having a heat dissipating structure. The semicon...

  • Registered : 2026.06.09
  • View : 17

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